全氟硅烷改性氮化硼纳米片填充聚酰亚胺复合材料的导热性能研究-中国材料进展

文章信息/Info

Title:: Study on Thermal Conductivity of Polyimide Composites Filled with Perfluorosilane-Modified BNNS

作者:: 陈欣欣; 苗常青; 包思远; 张田; 许峥嵘; 韩鹏; 沈博洋; 胡杰; 刘睿; 1. 同济大学材料科学与工程学院，先进土木工程材料教育部重点实验室，上海-201804 2. 同济大学交通学院，高速磁浮运载技术全国重点实验室，磁浮交通工程技术研究中心，上海-201804

Author(s):: Chen Xinxin; Miao Changqing; Bao Siyuan; Zhang Tian; Xu Zhengrong; Han Peng; Shen Boyang; Hu Jie; Liu Rui; 1 Key Laboratory of Advanced Civil Engineering Materials of Ministry of Education, School of Materials Science and Engineering, Tongji University,Shanghai 201804, P.R. China 2. State Key Laboratory of High-speed Maglev Transportation Technology，National Maglev Transportation Engineering R&D Center, College of Transportation, Tongji University, Shanghai 201804, P.R. China

Keywords:: Boron Nitride Nanosheets; Polyimide; Surface Modification; Thermal Conductivity; Interfacial Compatibility

摘要:: 聚酰亚胺复合材料凭借出色的耐高温与绝缘特性，广泛用于微电子器件、大功率电子封装及轨道交通热管理，但填料与基体之间的界面相容性仍是主要挑战。本文报道了一种具有增强导热性能的氟化改性氮化硼纳米片/聚酰亚胺复合膜的制备方法。通过将全氟辛基硅烷接枝到氮化硼纳米片表面，成功将其由亲水性转变为疏水性，改善了与疏水性聚酰亚胺基体的界面相容性。这种界面设计确保了氮化硼纳米片在基体中的均匀分散，并有效降低了界面热阻。得益于界面结构的优化，所制备的全氟硅烷改性氮化硼纳米片填充聚酰亚胺复合膜导热系数达0.3610 W·m-1·K-1，较纯聚酰亚胺薄膜（0.2053 W·m-1·K-1）提升了75.8%。本研究为通过调控填料-基体相容性、开发高性能热管理材料提供了普适性思路。

Abstract:: Polyimide composites, owing to their outstanding thermal resistance and electrical insulation properties, have been extensively employed in microelectronic devices, high-power electronic packaging, and thermal management for rail transit. However, the poor interfacial compatibility between fillers and the matrix remains a major challenge. Herein, we report a fabrication method for a fluorinated boron nitride nanosheet/polyimide composite film with enhanced thermal conductivity. By grafting perfluorooctylsilane onto the surface of boron nitride nanosheets, the originally hydrophilic nanosheets are successfully converted into hydrophobic, thereby improving their interfacial compatibility with the hydrophobic polyimide matrix. This interface engineering ensures uniform dispersion of the boron nitride nanosheets within the matrix and effectively reduces the interfacial thermal resistance. Benefiting from the optimized interfacial structure, the resulting perfluorosilane-modified boron nitride nanosheet-filled polyimide composite film achieves a thermal conductivity of 0.3610? W·m-1·K-1, representing a 75.8?% enhancement compared with that of the pristine polyimide film (0.2053 W·m-1·K-1). This work provides a universal strategy for developing high-performance thermal management materials through the modulation of filler–matrix compatibility.