嵌埋陶瓷基板散热的热阻问题分析-中国材料进展

文章信息/Info

Title:: Thermal Resistance Analysis of Ceramic Embedded FR4 Heat Dissipation Substrate

Author(s):: QIN Diancheng; CHEN Aibing; (Rayben Technologies (Zhuhai) Ltd. Co., Zhuhai 519180, China)

摘要:: 基于热电分离式设计理念，首先将表面经金属化处理且具备高导热率的AlN陶瓷片局部嵌入导热率较低的FR4材料中，利用压合工艺将二者复合制备成用于LED散热管理的嵌埋陶瓷基板；然后借助SMT工艺将LED灯珠与上述散热基板组装成LED模组；最后利用结温测试仪以及恒温控制系统对不同AlN尺寸及不同功率LED的上述模组进行了结温测试，并依据结温测试结果对上述嵌埋陶瓷基板的散热能力进行了对比研究。结果表明，当LED功率一定时，随着AlN陶瓷片尺寸不断加大，嵌埋陶瓷的扩散热阻及一维热阻均随之减小，从而致使基板总热阻呈现出下降趋势，LED的结温也因此而随之降低。而随着LED功率不断增加，嵌埋同一尺寸AlN陶瓷片的散热基板因一维热阻保持不变，扩散热阻不断增加，从而导致基板的总热阻也不断增加。

Abstract:: Based on the thermoelectric separation concept, metalized AlN ceramic blocks of high thermal conductivity were embedded into FR4 materials of relatively low thermal conductivity for the preparation of ceramicembedded substrates for LED heat dissipation management employing lamination technologies. Secondly, LED lamps were mounted on the aforementioned substrates to form LED modules, the junction temperature of which were tested using junction temperature tester and temperature control table in terms of different AlN sizes and different LED powers. Additionally, the heat dissipation performances of the aforementioned substrates were studied on the base of junction temperature test results. The result showed that when the LED powers were constant, both the spread thermal resistances and onedimensional thermal resistances of the ceramicembedded substrates decreased as the AlN block sizes increased, thus led to decreased overall thermal resistances.