冷凝传热仿生界面材料研究进展-中国材料进展

文章信息/Info

Title:: Research Progress in Bio-Inspired Interface Materials for Condensation Heat Transfer

Author(s):: XING Dandan; WU Feifei; WANG Rui; ZHU Jie; GAO Xuefeng; 1. Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences2. University of Science and Technology of China

Keywords:: bio-inspired; superhydrophobic surface; hydrophilic-hydrophobic hybrid surface; super-slippery surface; condensation heat transfer

摘要:: 随着电子器件微型化、集成化、大功率化发展及其对小尺度空间高热流密度散热技术提出了迫切需求，如何设计开发高效冷凝传热界面材料引起国内外广泛关注。相比膜状冷凝，滴状冷凝是一种更为高效的能量输运方式。然而，普通光滑疏水表面的离散冷凝液滴往往靠重力驱离，其自身热阻仍相对较高，更新频率也相对缓慢。因此，通过金属材料表面的合理设计来减少冷凝液滴的驱离尺寸并同时增加成核密度以实现传热效率的大幅度提升已成为当前研究热点。受生物灵感启发，可用于冷凝传热强化的仿蝉翼超疏水界面、仿沙漠甲虫亲疏水复合界面以及仿猪笼草超润滑界面研究体系已取得突破性进展。本综述简要回顾了该领域的最新进展及各自存在的问题。相关总结将有助于进一步设计开发有应用前景的高效冷凝传热界面材料及相变热控器件。

Abstract:: With the development of miniaturization, integration and high power of electronic devices and their urgent need for technologies enabling to solve high heat flux density dissipation at small-scale space, research on high-efficiency condensation heat transfer (CHT) interface materials has attracted widespread attention. Compared with filmwise condensation, dropwise condensation is a type of more efficient heat transfer way. However, discrete condensate drops on ordinary hydrophobic flat surfaces only can depart under gravity with relatively higher drop thermal resistance and slower renewal frequency, which is disadvantage to CHT. Clearly, how to realize high-density self-renewal of small-scale condensate microdrops for more efficient energy transport has become current research focus. So far, great breakthrough has been made in the development of bio-inspired surfaces for enhancing CHT, including superhydrophobic surfaces mimicking cicada wings, hydrophilic-hydrophobic hybrid surfaces mimicking desert beetles and super-slippery surfaces mimicking the peristome of pitcher plants. In this review, we briefly summarize their latest progress and respective issues, which are helpful to develop high-efficiency CHT interface materials for phase-change-based heat dissipation devices.