Center for Flexible Micro and Nano-Systems, School of Information Science and Engineering, Fudan University, Shanghai 200433, China)
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DOI:
10.7502/j.issn.1674-3962.2014.03.02
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Abstract:
As an emerging technology, the internet of things (IoT) offers the potential to connect everyday’s objects in the real physical world to cyber space such that it forms a network of things for smart sensing, control and management. Due to its flexibility, bendability and deformability, flexible large area electronics (FLAE) have found a unique position for smart things, and it becomes a core-technology that bridges the real world things to cloud. In this article, we review advances and recent progress of FLAE, mainly based on the results developed in author’s group. This covers devices of printed thin film transistors (TFT), memories and flexible sensors etc., and integrated circuits and systems for IoT applications such as fully metallic printed RFID (radio frequency identification) tag and antenna, intelligent package and bio-patch for food safety and healthcare. Future challenges and difficulties for FLAE in materials preparation, devices fabrication and system integration etc., are also discussed.