(1National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics,Peking University, Beijing 100871, P.R. China) (2Peking University Shenzhen Graduate School, Shenzhen, China ) (3Electron Microscopy Laboratory, Peking University, Beijing 100871, P.R. China )
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DOI:
10.7502/j.issn.1674-3962.2013.12.05
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Abstract:
This paper focuses on the combination of Focused Ion Beam Stress-introduced Deformation (FIB-SID) and micro-fabrication technology, describing the fabrication process and test methods of metal passive micro-helix inductor. First of all, the suspended metal cantilever is made on SOI(Silicon-on-insulator) by photolithography, sputtering and isotropic etching. Then, the stress is introduced to fabricate 3D metal passive micro-helix inductor with different sizes by controlling ion dose, FIB stress introduced time t, FIB scanning pitch l. Finally, the metal passive micro-helix inductor is test at high frequency with the help of Agilent network analyzers and microwave probe station using GSG test structure and de-embedding process.