2018 12
Elastic Strain Engineering
Ju Li; Zhiwei Shan; Evan Ma
2018 12 [1－5][Abstract](7241)[pdf 2227KB](4164)[ HTML ]
Polymers in 3D Bioprinting: Progress and Challenges

MAO Hongli, GU Zhongwei
2018 12 [6－10][Abstract](6820)[pdf 17154KB](3167)[ HTML ]
Al-modified environmental barrier coating prepared by atmospheric plasma spray
ZHANG Xiaofeng1, ZHOU Kesong1, LIU Min1, LI Hong1, YANG Haitang2, NIU Shaopeng1, DENG Chunming1, DENG Changguang1
2018 12 [11－15][Abstract](4521)[pdf 17633KB](3126)
Recent Advances on White Organic Light-Emitting Diodes
WEI Pengcheng，SONG Xiaozeng，DUAN Lian
2018 12 [16－20][Abstract](6244)[pdf 5397KB](3354)[ HTML ]
Research Progress of Hydrogen-Chromic Magnesium-Based Thin Films
PENG Liming，LIU Yue，CHEN Juan，DING Wenjiang
2018 12 [21－25][Abstract](6169)[pdf 5783KB](3225)[ HTML ]
Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview
ZHANG Di, TAN Zhanqiu, XIONG Ding-Bang, LI Zhiqiang
2018 12 [26－30][Abstract](4272)[pdf 3211KB](3596)[ HTML ]
Research Progress and Outlook of Flexible Heat Pipe
TAO Peng, CHANG Chao, GUO Huaixin, CHEN Huanbei, SHANG Wen, DENG Tao
2018 12 [31－35][Abstract](5092)[pdf 5470KB](3844)
Research Progress in Bio-Inspired Interface Materials for Condensation Heat Transfer
XING Dandan，WU Feifei，WANG Rui，ZHU Jie，GAO Xuefeng
2018 12 [36－40][Abstract](4849)[pdf 13427KB](3253)[ HTML ]
Research Progress on the Thermal Characterization Technology of High Power Device and Material
GUO Huaixin, HUANG Yuheng, HUANG Yulong, TAO Peng, KONG Yuecan, LI Zhonghui, CHEN Tangseng
2018 12 [41－45][Abstract](3983)[pdf 8142KB](3054)[ HTML ]
Progress in the Researches on Enhancement Effects of Nanofluids on Boiling Heat Transfer
WANG Dongmin, QUAN Xiaojun, LI Jinjing
2018 12 [46－60][Abstract](4682)[pdf 4802KB](3124)[ HTML ]
Study on Application of High Thermal conductivity Materials in Aerospace Thermal Management
LEI Zhibo， CAO Jianguang， DONG Lining， DONG Jian， BI Zhenhan
2018 12 [51－55][Abstract](4592)[pdf 2774KB](3292)[ HTML ]
The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials
WANG Xingang,Zhang Runmei, CHEN Diandian,ZENG Dejun,XU Xiqing,YUAN Zhanwei
2018 12 [56－60][Abstract](4844)[pdf 1712KB](3572)