金属基板结构对LED散热性能的影响-中国材料进展

文章信息/Info

Title:: Influence of MCPCBs Structure on Heat Dissipation Performance of LED Lamp

Author(s):: QIN Diancheng; LIANG Kewei; CHEN Aibing; XIAO Yonglong; （Guangdong LED PackageUsed Heat Dissipation Substrate Engineering Technology Research Center,Rayben Technologies (Zhuhai) Limited, Zhuhai 519180, China）

Keywords:: angel eye; LED; heat dissipation; MCPCB; thermoelectric separation; junction temperature

摘要:: 为满足天使眼汽车照明用LED灯的散热需求，设计了4种散热管理方案，同时利用结温测试仪与热电偶分别对上述4种方案的LED灯珠结温及金属基板（MCPCB）底部温度进行了测试，并对4种方案的散热效果展开了对比研究。结果表明，表面贴装技术（SMT）焊接方案较铆接方案具备一定的散热优势，而热电分离式金属基板的焊接方案较普通金属基板的焊接方案散热优势明显，能大幅度降低LED结温，有望赋予天使眼LED灯更加优异的综合性能；当环境温度分别为（25±1）及（90±3）℃时，4种方案的散热效果为：0.4 mm厚热电分离式金属基板的焊接方案＞0.3 mm厚普通金属基板的焊接方案＞1.0 mm厚普通金属基板的铆接方案＞0.3 mm厚普通金属基板的铆接方案；当环境温度为（25±1） ℃时，4种散热方案下的LED结温均在最高允许温度135 ℃以内。而当环境温度为（90±3） ℃时，只有使用热电分离式金属基板焊接方案的天使眼的LED结温低于最高允许温度，为117.92 ℃，其它3种方案的天使眼LED结温均超过最高允许温度。

Abstract:: Four types of solutions were proposed to meet the heat dissipation requirement of angel eye automobile headlight, with junction temperature tester and thermocouple employed to measure the LEDs junction temperature and the bottom side temperature of LED mounted metal core printed circuit board (MCPCB) for the comparative study of their heat dissipation performances. It was found that surface mounting technology（SMT） welding solution presented a better heat dissipation performance than riveting solution did, and thermoelectric separation MCPCB beat regular MCPCB to dissipate heat generated by LEDs using SMT technology. When the ambient temperatures were （25±1） and （90±3） ℃ respectively, the heat dissipation effects of the four schemes are as follows: LED mounted on 0.4 mm thermoelectric separation MCPCB using SMT method > LED mounted on 0.3 mm regular MCPCB using SMT method > LED mounted on 1.0 mm regular MCPCB using riveting method > LED mounted on 0.3 mm regular MCPCB using riveting method. When the ambient temperature was （25±1） ℃, the above four types of heat dissipation solutions resulted in junction temperatures within the limit temperature of 135 ℃. But when the ambient temperature was （90±3） ℃, only LED mounted on 0.4 mm thermoelectric separation MCPCB using SMT method produced the junction temperature below the limit temperature of 135 ℃.