[1]张荻,谭占秋,熊定邦,等.热管理用金属基复合材料的应用现状及发展趋势[J].中国材料进展,2018,(12):026-30.[doi:10.7502/j.issn.1674-3962.2018.12.06]
ZHANG Di,TAN Zhanqiu,XIONG Ding-Bang,et al.Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview[J].MATERIALS CHINA,2018,(12):026-30.[doi:10.7502/j.issn.1674-3962.2018.12.06]
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热管理用金属基复合材料的应用现状及发展趋势(
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中国材料进展[ISSN:1674-3962/CN:61-1473/TG]
- 卷:
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- 期数:
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2018年第12期
- 页码:
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026-30
- 栏目:
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- 出版日期:
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2018-12-31
文章信息/Info
- Title:
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Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview
- 作者:
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张荻; 谭占秋; 熊定邦; 李志强
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上海交通大学,材料科学与工程学院,金属基复合材料国家重点实验室
- Author(s):
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ZHANG Di; TAN Zhanqiu; XIONG Ding-Bang; LI Zhiqiang
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State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University
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- 关键词:
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金属基复合材料; 热管理; 热膨胀系数; 热导率
- Keywords:
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metal matrix composites (MMCs); thermal managements; coefficient of thermal expansion; thermal conductivity
- DOI:
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10.7502/j.issn.1674-3962.2018.12.06
- 文献标志码:
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A
- 摘要:
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从不同种类金属基复合材料的性能特点、国内外主流企业与主要产品、典型热管理应用等几方面,综述了近年来金属基复合材料在热管理领域的实际应用现状,并展望了金属基复合材料在应对未来高功率密度热管理需求的发展方向。基于高导热、低膨胀的共性特征,硅/铝、碳化硅/铝、碳纤维/铝等铝基复合材料以轻质、低成本、可加工的性能优势,在航空航天、交通运输领域得到了广泛应用;而碳纤维、碳化硅、金刚石等增强铜基复合材料则凭其高的环境耐受性和稳定性,在军事国防领域逐渐崭露头角。针对电子器件功率密度持续攀高,国家重点研发计划已立项专门开展超高热导率(≥800W/mK)金属基复合材料研制,纳米尺度复合界面改性设计、新型复合构型化及超高导热增强体的发现发展,可能引领热管理领域新的研究热点。
- Abstract:
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The thermal performances and characteristics, products from main companies at home and abroad, and examples of typical thermal management applications of different metal matrix composites (MMCs) were reviewed. The possible future developments of MMCs used for thermal managements of high power density were predicted. Based on the common characteristics of high thermal conductivity and low coefficient of thermal expansion, silicon/aluminum, silicon carbide/aluminum and carbon fiber/aluminum composites, featured of light weight, low cost and machinability, have been widely used in the areas of aerospace, aviation and transportation. Carbon fiber, silicon carbide, diamond particles reinforced copper composites were also gradually emerging in the of military fields, due to their high environmental tolerance and stability. As responses to electronic packaging with ever increasing power density, the National Key Research & Development Plan has been dedicated to carry out projects focusing on MMCs with ultrahigh thermal conductivity over 800 W/mK. It’s supposed that, nanoscale interface design, novel architecture and new reinforcements with ultrahigh thermal conductivity, may lead to new popular studies in MMCs for thermal management applications.
备注/Memo
- 备注/Memo:
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收稿日期:2018-6-15
基金项目:国家重点研发计划资助项目(Nos. 2017YFB0406100,2017YFB0406200); 国家自然科学基金项目(No. 51401123)
第一作者:张荻,男,1957年生,教授,博士生导师
通讯作者:张荻,男,1957年生,教授,博士生导师,Email:zhangdi@sjtu.edu.cn;
? ? ? ? ? ? ? ? ? 李志强,男,1973年生,教授,博士生导师,Email:lizhq@sjtu.edu.cn
更新日期/Last Update:
2018-11-30