[1]周吉发,王蒙,李宁波,等.电弧增材SnSb8Cu4合金的组织与性能研究[J].中国材料进展,2026,45(03):251-258.[doi:10.7502/j.issn.1674-3962.202411027]
 ZHOU Jifa,WANG Meng,LI Ningbo,et al.Study on Microstructure and Properties of Wire Arc Additive Manufactured SnSb8Cu4 Alloy[J].MATERIALS CHINA,2026,45(03):251-258.[doi:10.7502/j.issn.1674-3962.202411027]
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电弧增材SnSb8Cu4合金的组织与性能研究()

中国材料进展[ISSN:1674-3962/CN:61-1473/TG]

卷:
45
期数:
2026年03
页码:
251-258
栏目:
出版日期:
2026-03-31

文章信息/Info

Title:
Study on Microstructure and Properties of Wire Arc Additive Manufactured SnSb8Cu4 Alloy
文章编号:
1674-3962(2026)03-0251-08
作者:
周吉发王蒙李宁波贾飞赵丹励乾民程战
中国机械总院集团 宁波智能机床研究院有限公司,浙江 宁波 315700
Author(s):
ZHOU JifaWANG MengLI NingboJIA FeiZHAO DanLI QianminCHENG Zhan
Ningbo Intelligent Machine Tool Research Institute Co., Ltd., China Machinery General Institute Group, Ningbo 315700, China
关键词:
锡基巴氏合金电弧增材制造技术显微组织力学性能结合强度
Keywords:
tin-based Babbitt alloy wire arc additive manufacturing microstructuremechanical properties bonding strength
分类号:
TG444
DOI:
10.7502/j.issn.1674-3962.202411027
文献标志码:
A
摘要:
通过基于冷金属过渡(CMT)的电弧增材制造技术在Q235钢表面制备6~7 mm厚度的SnSb8Cu4合金层。采用光学显微镜(OM)、X射线衍射仪(XRD)、扫描电子显微镜(SEM)及能谱分析仪(EDS)对锡基巴氏合金的显微组织、相组成及元素分布进行检测和分析;通过布氏硬度计、万能材料试验机检测SnSb8Cu4合金铸锭和CMT电弧增材层的硬度、抗拉强度及界面结合强度。研究结果表明:CMT电弧增材工艺不改变合金的物相组成,但可以优化锡基巴氏合金的组织结构,通过细晶强化、析出相弥散强化等强化机理提升合金的力学性能。SnSb8Cu4合金电弧增材层的平均布氏硬度和平均抗拉强度分别为26.3HBW10/250/30和79.11 MPa,与铸造巴氏合金相比,电弧增材工艺使硬度提升10.04%,抗拉强度提升25.57%。此外,电弧增材工艺下锡基巴氏合金/Q235钢结合试样形成厚度约为7 μm的中间界面层,形成冶金结合,界面结合强度达到91.31 MPa。
Abstract:
In this study, cold metal transfer (CMT) based wire arc additive manufacture technology was used to lay a 6~7 mm thick SnSb8Cu4 alloy layer on the surface of Q235 steel. The microstructure, phase composition and element distribution of tinbased Babbitt alloy were detected and analyzed using optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). A Brinell hardness tester and a universal testing machine tested the hardness, tensile strength and interfacial bonding strength of SnSb8Cu4 alloy ingots and CMT based arc additive layers. The research results indicate that the CMT arc additive manufacturing process does not change the phase composition of the alloy, but optimizes the microstructure of tinbased Babbitt alloy and improves its mechanical performance through strengthening mechanisms such as fine grain strengthening and second phase strengthening. The average Brinell hardness and the average tensile strength of the SnSb8Cu4 alloy arc additive layer are 26.3HBW10/250/30 and 79.11 MPa, respectively. Compared with cast Babbitt alloy, the arc additive process increases the hardness by 10.04% and the tensile strength by 25.57%. In addition, with the arc additive process, a middle interface layer with a thickness of about 7 μm is formed between tin-based Babbitt alloy and Q235 steel, which is a metallurgical bonding with an interface bonding strength of 91.31 MPa.

备注/Memo

备注/Memo:
收稿日期:2024-11-29修回日期:2025-03-24 基金项目:宁波市“3315”人才计划2020年创新团队C类项目(2020A-28-C) 第一作者:周吉发,男,1995年生,工程师 通讯作者:程战,男,1989年生,高级工程师,硕士生导师, Email:brazecheng@163.com
更新日期/Last Update: 2026-02-27