[1]王新刚,张润梅,陈典典,等.WCu/MoCu电子封装材料的研究现状与发展趋势[J].中国材料进展,2018,(12):056-60.[doi:10.7502/j.issn.1674-3962.2018.12.08]
 WANG Xingang,Zhang Runmei,CHEN Diandian,et al.The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials[J].MATERIALS CHINA,2018,(12):056-60.[doi:10.7502/j.issn.1674-3962.2018.12.08]
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WCu/MoCu电子封装材料的研究现状与发展趋势()
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中国材料进展[ISSN:1674-3962/CN:61-1473/TG]

卷:
期数:
2018年第12期
页码:
056-60
栏目:
出版日期:
2018-12-31

文章信息/Info

Title:
The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials
作者:
王新刚张润梅陈典典曾德军许西庆袁战伟
长安大学材料科学与工程学院
Author(s):
WANG XingangZhang Runmei CHEN DiandianZENG DejunXU XiqingYUAN Zhanwei
School of Materials Science and Engineering, Chang’an University
关键词:
WCu/MoCu合金电子封装热导率热膨胀系数发展趋势
Keywords:
WCu/MoCu alloys electronic packaging thermal conductivity coefficient of thermal expansion development trend
DOI:
10.7502/j.issn.1674-3962.2018.12.08
文献标志码:
A
摘要:
电子设备集成度和运行速度的不断提高以及大功率芯片的使用,对电子封装材料的性能提出了更高的要求。尽管已经实现产业化,WCu/MoCu合金作为第二代电子封装材料,其未来发展正面临极大的挑战,既有可能持续应用于封装领域,也有可能在与其它材料的竞争中被淘汰。在现有技术的基础上,使WCu/MoCu复合材料充分融合各组元的优点,以获得具有高热导率、低热膨胀系数以及良好力学性能的电子封装材料,已成为迫在眉睫的工作。本文综述了电子封装材料的性能指标,以及WCu/MoCu合金的热学性能与制备工艺, 并针对高热导率这一关键性能对其发展趋势进行了展望。
Abstract:
Due to the increase of integration and running speed in electronic equipments, along with the employment of high power chips, electronic packaging materials with better properties are claimed. As the second-generation electronic packaging materials, WCu/MoCu alloys are confronted with great challenges in the future development, even though their industrialization has been realized. On one hand, they are possible to continue their application in electronic packaging; one the other hand, they may be eliminated in the competition against other materials. Therefore, it is imperative to fully take advantage of each component in WCu/MoCu alloys based on the current technology, and to obtain electronic packaging materials with high thermal conductivity, low coefficient of thermal expansion and superior mechanical properties. In this paper, the performance index of electronic packaging materials are introduced, and the thermal properties and preparation techniques of WCu/MoCu alloys are reviewed. Moreover, prospects on the development trend of WCu/MoCu alloys are presented, aiming at the key property of high thermal conductivity.

备注/Memo

备注/Memo:
收稿日期:2018-06-25
基金项目:国家自然科学基金资助项目(51177006);国家重点研发计划项目(2017YFB0406100)
第一作者:王新刚,男,1969年生,教授,博士生导师,Email:xawxg@163.com
更新日期/Last Update: 2018-11-30