半导体照明用有机无机纳米复合封装胶材料进展-中国材料进展

文章信息/Info

Title:: Progress in OrganicInorganic Nanocomposite Encapsulants for Semiconductor Lighting

Author(s):: HE Xianglei; PU Yuan; WANG Dan; CHEN Jianfeng; (College of Chemical Engineering, Beijing University of Chemical Technology, Beijing 100029, China)

Keywords:: electronic materials; composite; interface; high refractive index; optical hybrid material; LED encapsulation materials

摘要:: 基于发光二极管（LED）的半导体照明，具有高效、节能、环保、安全等特点，是实现节能减排的有效途径，代表了照明器件的发展方向。封装材料是半导体照明器件的关键支撑材料，它不仅需要隔绝水氧以保护芯片，还需要同时具有高透光性及高折射率以提高发光二极管照明器件的光提取效率。将高折射率无机纳米粒子与有机树脂基材复合，从而提高发光二极管器件的光提取效率，进而强化照明器件的节能增效应用，是当前发光二极管照明器件研发领域关注的重点。介绍了有机无机复合材料在发光二极管封装材料中的应用，重点综述了近年来高折射率有机无机纳米复合封装材料的研究进展，并结合本课题组的工作基础，展望了高折射率封装材料存在的问题和未来的发展方向。

Abstract:: Semiconductor lighting based light-emitting diode (LED), with its remarkable features of high efficiency, energy conservation, environmental protection, and safety, is an effective choice to achieve energy-saving and emission reduction, which represents the development direction of lighting devices. The encapsulation material is a key supporting material for the semiconductor lighting device, not only needs to isolate water and oxygen to protect the chip but also needs to have high light transmittance and high refractive index to improve the light extraction efficiency of the LED lighting device. The high refractive index inorganic nanoparticles are combined with the organic resin to improve the light extraction efficiency of the LED device, thereby enhancing the energy-saving effect of the semiconductor lighting device. The above-mentioned solution is the focus of current research and development of LED lighting devices. This paper introduces the application of organic-inorganic nanocomposites in LED encapsulation materials and focuses on the research progress of high refractive index organic-inorganic composite packaging materials in recent years. At the same time, combined with the work basis of our group, the problems of high refractive index encapsulation materials are analyzed and the future development direction of the encapsulation industry is prospected.