位错三维表征技术-中国材料进展

文章信息/Info

作者:: 符锐1; 冯宗强1; 2; 3; 黄晓旭1; 2; 3; （1.重庆大学材料科学与工程学院，重庆 400044）（2.重庆大学电子显微镜中心，重庆 400044） (3. 重庆大学轻合金材料教育部国际合作联合实验室，重庆 400044）

Author(s):: FU Rui1; FENG Zongqiang1; 2; 3; HUANG Xiaoxu1; 2; 3; (1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China) (2. Electron Microscopy Center, Chongqing University, Chongqing 400044, China) (3. International Joint Laboratory for Light Alloys (MOE), Chongqing University, Chongqing 400044, China)

Keywords:: dislocation; 3D characterization; synchrotron radiation Xray; electron channeling contrast imaging; TEM; stereology imaging; tomographic crystallography of dislocations

摘要:: 位错的三维表征是准确认识位错特性和行为的基础。综述了基于同步辐射X射线、聚焦离子束电子通道衬度成像系统和透射电子显微镜的位错三维重构方法，重点介绍了基于透射电子显微镜的原子分辨率位错三维重构、体视学原理位错三维重构和系列倾转位错三维重构方法的技术原理和应用实例，对比讨论了上述技术在分辨率、定量表征和参量信息耦合能力方面的优缺点，随后介绍了一种基于透射电子显微镜、可以实现位错几何和晶体学特征参量高精度耦合表征的位错三维定量集成表征技术，并在此基础上总结和展望了未来各类位错三维表征技术的发展趋势和技术特点。

Abstract:: The three-dimensional (3D) characterization of dislocations is the basis for full understanding the characteristics and behaviors of dislocations. In this article, the 3D dislocation characterization techniques based on the synchrotron radiation X-ray, the focused ion beam-electron channeling contrast imaging system and the transmission electron microscopy (TEM) are reviewed, with the emphases on the TEM-based methods such as atomic resolution, stereo pair and tilt-series reconstruction of dislocations. The spatial resolution, capability of quantification and coupling of parameters in all these methods are compared and discussed. A novel TEM-based tomographic crystallography method which can simultaneously, quantitatively and precisely characterize the geometric and crystallographic parameters of 3D dislocation structures is also introduced. Further, the technical trends and characteristics of the 3D dislocation characterization techniques in the future are foreseen and summarized.