基于FIB-SID技术的三维金属无源电感制备与测试-中国材料进展

文章信息/Info

Title:: The fabrication and testing of 3D metal passive inductor based on FIB-SID technology

作者:: 毛逸飞¹; 王志强¹; 2; 赵路睿¹; 吴文刚¹; 徐军³; (¹北京大学微米/纳米加工技术国家重点实验室,北京100871)
(²北京大学深圳研究院,深圳 )
(³北京大学电子显微镜实验室,北京100871 )

Author(s):: Y.F.Mao¹; Z.Q.Wang¹; 2; L.R.Zhao¹; W.G.Wu¹; J.Xu³; (¹National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics,Peking University, Beijing 100871, P.R. China)
(²Peking University Shenzhen Graduate School, Shenzhen, China )
(³Electron Microscopy Laboratory, Peking University, Beijing 100871, P.R. China )

摘要:: 本文重点研究了聚焦离子束的相关原理和应用。主要利用聚焦离子束应力引入致形变（Focused Ion Beam Stress-introduced deformation, FIB-SID）技术与常规微加工工艺相结合，制备微型金属无源螺旋电感的设计方法和工艺流程，并对其电学性能进行初步高频测试。首先在SOI（Silicon-on-insulator）基片上通过光刻，溅射以及各项同性刻蚀等常规工艺制得悬浮的金属悬臂梁，再利用FIB刻蚀原理进行应力引入，通过控制注入离子剂量、FIB应力引入的次数t、FIB扫描的间距l等试验参数制得不同尺寸结构的三维螺旋金属无源电感。最后，采用安捷伦网络分析仪与微波探针台，使用GSG结构及相应的去嵌方法，对微型金属螺线管电感进行了高频测试。得出了三维螺旋微纳电感的电感值、品质因子、电压驻波比、回波损耗随频率变化关系。

Abstract:: This paper focuses on the combination of Focused Ion Beam Stress-introduced Deformation (FIB-SID) and micro-fabrication technology, describing the fabrication process and test methods of metal passive micro-helix inductor. First of all, the suspended metal cantilever is made on SOI(Silicon-on-insulator) by photolithography, sputtering and isotropic etching. Then, the stress is introduced to fabricate 3D metal passive micro-helix inductor with different sizes by controlling ion dose, FIB stress introduced time t, FIB scanning pitch l. Finally, the metal passive micro-helix inductor is test at high frequency with the help of Agilent network analyzers and microwave probe station using GSG test structure and de-embedding process.