2018 12
Elastic Strain Engineering
Ju Li; Zhiwei Shan; Evan Ma
2018 12 [1－5][Abstract](11281)[pdf 2227KB](6569)[ HTML ]
Polymers in 3D Bioprinting: Progress and Challenges

MAO Hongli, GU Zhongwei
2018 12 [6－10][Abstract](9820)[pdf 17154KB](4771)[ HTML ]
Al-modified environmental barrier coating prepared by atmospheric plasma spray
ZHANG Xiaofeng1, ZHOU Kesong1, LIU Min1, LI Hong1, YANG Haitang2, NIU Shaopeng1, DENG Chunming1, DENG Changguang1
2018 12 [11－15][Abstract](8154)[pdf 17633KB](5052)
Recent Advances on White Organic Light-Emitting Diodes
WEI Pengcheng，SONG Xiaozeng，DUAN Lian
2018 12 [16－20][Abstract](8563)[pdf 5397KB](5019)[ HTML ]
Research Progress of Hydrogen-Chromic Magnesium-Based Thin Films
PENG Liming，LIU Yue，CHEN Juan，DING Wenjiang
2018 12 [21－25][Abstract](8793)[pdf 5783KB](5172)[ HTML ]
Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview
ZHANG Di, TAN Zhanqiu, XIONG Ding-Bang, LI Zhiqiang
2018 12 [26－30][Abstract](7690)[pdf 3211KB](6211)[ HTML ]
Research Progress and Outlook of Flexible Heat Pipe
TAO Peng, CHANG Chao, GUO Huaixin, CHEN Huanbei, SHANG Wen, DENG Tao
2018 12 [31－35][Abstract](7335)[pdf 5470KB](6045)
Research Progress in Bio-Inspired Interface Materials for Condensation Heat Transfer
XING Dandan，WU Feifei，WANG Rui，ZHU Jie，GAO Xuefeng
2018 12 [36－40][Abstract](7011)[pdf 13427KB](5074)[ HTML ]
Research Progress on the Thermal Characterization Technology of High Power Device and Material
GUO Huaixin, HUANG Yuheng, HUANG Yulong, TAO Peng, KONG Yuecan, LI Zhonghui, CHEN Tangseng
2018 12 [41－45][Abstract](6494)[pdf 8142KB](5063)[ HTML ]
Progress in the Researches on Enhancement Effects of Nanofluids on Boiling Heat Transfer
WANG Dongmin, QUAN Xiaojun, LI Jinjing
2018 12 [46－60][Abstract](8135)[pdf 4802KB](5070)[ HTML ]
Study on Application of High Thermal conductivity Materials in Aerospace Thermal Management
LEI Zhibo， CAO Jianguang， DONG Lining， DONG Jian， BI Zhenhan
2018 12 [51－55][Abstract](7326)[pdf 2774KB](5798)[ HTML ]
The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials
WANG Xingang,Zhang Runmei, CHEN Diandian,ZENG Dejun,XU Xiqing,YUAN Zhanwei
2018 12 [56－60][Abstract](8242)[pdf 1712KB](5860)