2018 12
Elastic Strain Engineering
Ju Li; Zhiwei Shan; Evan Ma
2018 12 [1－5][Abstract](8483)[pdf 2227KB](5003)[ HTML ]
Polymers in 3D Bioprinting: Progress and Challenges

MAO Hongli, GU Zhongwei
2018 12 [6－10][Abstract](7658)[pdf 17154KB](3615)[ HTML ]
Al-modified environmental barrier coating prepared by atmospheric plasma spray
ZHANG Xiaofeng1, ZHOU Kesong1, LIU Min1, LI Hong1, YANG Haitang2, NIU Shaopeng1, DENG Chunming1, DENG Changguang1
2018 12 [11－15][Abstract](5689)[pdf 17633KB](3894)
Recent Advances on White Organic Light-Emitting Diodes
WEI Pengcheng，SONG Xiaozeng，DUAN Lian
2018 12 [16－20][Abstract](7272)[pdf 5397KB](4114)[ HTML ]
Research Progress of Hydrogen-Chromic Magnesium-Based Thin Films
PENG Liming，LIU Yue，CHEN Juan，DING Wenjiang
2018 12 [21－25][Abstract](7415)[pdf 5783KB](4099)[ HTML ]
Application and Prospect of Metal Matrix Composites for Thermal Management: an Overview
ZHANG Di, TAN Zhanqiu, XIONG Ding-Bang, LI Zhiqiang
2018 12 [26－30][Abstract](5118)[pdf 3211KB](4463)[ HTML ]
Research Progress and Outlook of Flexible Heat Pipe
TAO Peng, CHANG Chao, GUO Huaixin, CHEN Huanbei, SHANG Wen, DENG Tao
2018 12 [31－35][Abstract](5986)[pdf 5470KB](4729)
Research Progress in Bio-Inspired Interface Materials for Condensation Heat Transfer
XING Dandan，WU Feifei，WANG Rui，ZHU Jie，GAO Xuefeng
2018 12 [36－40][Abstract](5799)[pdf 13427KB](4017)[ HTML ]
Research Progress on the Thermal Characterization Technology of High Power Device and Material
GUO Huaixin, HUANG Yuheng, HUANG Yulong, TAO Peng, KONG Yuecan, LI Zhonghui, CHEN Tangseng
2018 12 [41－45][Abstract](4971)[pdf 8142KB](3808)[ HTML ]
Progress in the Researches on Enhancement Effects of Nanofluids on Boiling Heat Transfer
WANG Dongmin, QUAN Xiaojun, LI Jinjing
2018 12 [46－60][Abstract](5628)[pdf 4802KB](3882)[ HTML ]
Study on Application of High Thermal conductivity Materials in Aerospace Thermal Management
LEI Zhibo， CAO Jianguang， DONG Lining， DONG Jian， BI Zhenhan
2018 12 [51－55][Abstract](5631)[pdf 2774KB](4304)[ HTML ]
The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials
WANG Xingang,Zhang Runmei, CHEN Diandian,ZENG Dejun,XU Xiqing,YUAN Zhanwei
2018 12 [56－60][Abstract](5879)[pdf 1712KB](4426)